The Technology Development Board (TDB), under the Department of Science and Technology (DST), has signed an agreement with the Bengaluru-based company BigEndian Semiconductors. Under this agreement, financial assistance of ₹130 crore will be provided from the Research Development and Innovation (RDI) fund to develop an AI-powered semiconductor platform indigenously.
The total cost of ‘Project VeerAI’ is ₹260 crore. Its objective is to advance the technology from ‘Technology Readiness Level’ (TRL)-5 to TRL-9, making it ready for commercial use. TDB will provide this support through Optionally Convertible Debt (OCD).
The objective of ‘Project VeerAI’ is to develop a camera-based AI Vision System-on-Chip (SoC) for secure and smart applications. Initially, it will focus on CCTV and surveillance systems in India and the Global South.
The platform aims to integrate AI processing, connectivity, security, and privacy features while reducing reliance on foreign semiconductor technology. Going forward, this technology could be adopted for defense, automotive, industrial, and medical applications, potentially expanding the market scope for India-made AI semiconductor solutions.
TDB Secretary Rajesh Kumar Pathak stated that this collaboration would assist Indian companies in developing advanced technologies and bringing them to market.
Meanwhile, according to BigEndian Semiconductors, this financial support will accelerate the development, testing, and validation of Project VeerAI, helping to advance the AI ​​Vision SoC to TRL-9 and the stage of commercial deployment.
(PIB)
